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RSS FeedsMaterials, Vol. 11, Pages 2229: Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint (Materials)

 
 

10 november 2018 15:00:12

 
Materials, Vol. 11, Pages 2229: Imaging the Polymorphic Transformation in a Single Cu6Sn5 Grain in a Solder Joint (Materials)
 




In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that the monoclinic η′-Cu6Sn5 superlattice reflections appear in the hexagonal η-Cu6Sn5 diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η′-Cu6Sn5 contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.


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31 viewsCategory: Chemistry, Physics
 
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